Precision Grinding & Polishing Line for Stainless Steel Plates Used in Semiconductor Copper Foil Manufacturing
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Precision Grinding & Polishing Line for Stainless Steel Plates Used in Semiconductor Copper Foil Manufacturing

By:Lebon

Project Background

The customer specializes in manufacturing precision polished stainless steel plates used during the production of ultra-thin copper foil.

These products are widely supplied to major semiconductor and electronics manufacturers and are used throughout the PCB and semiconductor manufacturing process.

Typical applications include:

With the rapid growth of AI, semiconductor packaging and high-density PCB manufacturing, demand for ultra-thin copper foil has increased significantly, creating new expansion opportunities for suppliers throughout the industry.

To meet the growing production demand, the customer decided to expand capacity by investing in a second automated polishing line.

Processing Challenges

Unlike conventional decorative stainless steel, semiconductor-grade polishing plates are commonly manufactured from SUS630 and SUS450 stainless steel.

These precipitation-hardening stainless steels offer:

However, these advantages also make them considerably more difficult to grind and polish.

The production line must simultaneously achieve:

For equipment manufacturers, processing these high-hardness materials represents one of the most demanding applications in stainless steel surface finishing.

LEBON Solution

Building upon the successful operation of the customer's first production line, LEBON developed a significantly upgraded solution for the second project.

Key improvements include:

Intelligent Equipment Control

The new generation control system provides more intuitive operation, easier parameter adjustment and improved production consistency.

Easier Maintenance

Equipment layout and structural design were optimized to reduce maintenance time while improving accessibility for daily inspection and servicing.

Improved Water Circulation System

The upgraded coolant circulation system improves grinding stability while reducing water consumption and helping maintain consistent processing temperatures.

Optimized Scrap Collection

A redesigned waste collection system enables more efficient removal of grinding debris, helping maintain a cleaner production environment and improving long-term equipment reliability.

Higher Grinding Stability

By optimizing grinding pressure control, abrasive belt operation and machine rigidity, the production line delivers stable performance when processing high-hardness stainless steel.

Results

After installation and commissioning by LEBON engineers in Korea, the upgraded production line achieved the customer's production targets successfully.

Compared with the previous generation equipment, the new line provides:

The customer's continued investment demonstrates confidence in both the performance of the equipment and the long-term partnership with LEBON.

Industry Outlook

As semiconductor devices become smaller, faster and more powerful, manufacturers of copper foil and precision stainless steel carrier plates continue raising their quality standards.

This trend is creating increasing demand for high-precision grinding and polishing lines capable of processing high-hardness stainless steel materials such as SUS630 and SUS450.

For equipment suppliers, success depends not only on achieving superior surface quality, but also on improving automation, equipment stability, energy efficiency and long-term operating reliability.

LEBON continues to develop advanced grinding and polishing technologies to support customers in semiconductor, precision electronics and high-end metal surface finishing industries worldwide.

Project Highlights

Industry

Semiconductor Supply Chain

Application

Precision Stainless Steel Carrier Plates for Copper Foil Manufacturing

Material

SUS630 / SUS450 Stainless Steel

Surface Processing

Wet Grinding

Precision Polishing

Surface Finishing

Equipment

Automatic Wet Metal Surface Grinding & Polishing Line

Project Features


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